1. Die-Attach Materials for High Temperature Applications in Microelectronics Packaging : Materials, Processes, Equipment, and Reliability /: Materials, Processes, Equipment, and Reliability. ([2019]) Editors: Siow, Kim S Record Type: Book Extent: 1 online resource View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Advanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method /: wafer-level transfer packaging and fabrication techniques using interface energy control method. ([2018]) Authors: Seok, Seonho Record Type: Book Extent: 1 online resource (viii, 115 pages), 106 illustrations View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. RF and microwave microelectronics packaging II. (2017) Editors: Kuang, Ken; Sturdivant, Rick Record Type: Book Extent: 1 online resource (xii, 172 pages), illustrations (some color) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Semiconductor packaging : materials interaction and reliability /: materials interaction and reliability. (©2012) Other Names: Chen, Andrea; Lo, Randy Record Type: Book Extent: 1 online resource (xviii, 198 pages), illustrations View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. MEMS : fundamental technology and applications /: fundamental technology and applications. (©2013) Other Names: Choudhary, Vikas; Iniewski, Krzysztof, 1960- Record Type: Book Extent: 1 online resource (xxii, 456 pages), illustrations View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Introduction to microsystem packaging technology. (©2011) Other Names: Jin, Yufeng; Wang, Zhiping, 1962 October 6; Chen, Jing, 1974- Record Type: Book Extent: 1 online resource (xiii, 218 pages), illustrations View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Influence of temperature on microelectronics and system reliability : a physics of failure approach /: a physics of failure approach. (2020) Authors: Lall, Pradeep; Pecht, Michael; Hakim, Edward B Record Type: Book Extent: 1 online resource View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package /: high performance compute and system-in-package. (2021) Editors: Keser, Beth, 1971-; Kröhnert, Steffen Record Type: Book Extent: 1 online resource (323 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Fundamentals of microfabrication : the science of miniaturization /: the science of miniaturization. (2002) Other Names: Madou, Marc J Record Type: Book Extent: 1 online resource (723 pages, [18] pages of plates), illustrations (some color) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. MEMS : packaging and technology /: packaging and technology. (2017) Other Names: Choudhary, Vikas; Iniewski, Krzysztof, 1960- Record Type: Book Extent: 1 online resource (478 pages), (32 illustrations) View Content: Available online (eLD content is only available in our Reading Rooms) ↗