Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package /: high performance compute and system-in-package. (2021)

Record Type:
Book
Title:
Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package /: high performance compute and system-in-package. (2021)
Main Title:
Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package
Further Information:
Note: Edited by Beth Keser, Steffen Kröhnert.
Editors:
Keser, Beth, 1971-
Kröhnert, Steffen
Publisher Details:
Newark : John Wiley & Sons, Incorporated
Publication Date:
2021
Extent:
1 online resource (323 pages)
Subjects:
621.381/046
Microelectronic packaging
Electronic books
Languages:
English
ISBNs:
9781119793847
9781119793892
1119793890
9781119793908
1119793904
Related ISBNs:
111979384X
Notes:
Note: Description based upon print version of record.
Access Rights:
Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:
Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:
British Library HMNTS - ELD.DS.655359
Ingest File:
07_026.xml