Advanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method /: wafer-level transfer packaging and fabrication techniques using interface energy control method. ([2018])

• Record Type: Book
• Further Information: Note: By Seonho Seok.
• Authors: Seok, Seonho
• Contents: Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies. .
• Publisher Details: Cham : Springer International Publishing
• Publication Date: 2018
• Extent: 1 online resource (viii, 115 pages), 106 illustrations
• Subjects: 621.381/046; Engineering; Microelectronic packaging; Microelectromechanical systems; TECHNOLOGY & ENGINEERING / Mechanical; Coatings; Corrosion and anti-corrosives; Engineering; Machinery; Manufacturing industries; Materials science; Nanotechnology; Tools; Tribology; Technology & Engineering -- Nanotechnology & MEMS; Technology & Engineering -- Material Science; Nanotechnology; Precision instruments manufacture; Testing of materials; Tribology (friction & lubrication); Manufactures; Nanotechnology; Surfaces (Physics); Chemistry, inorganic; Technology & Engineering -- Manufacturing; Production engineering; Electronic books
• Languages: English
• ISBNs: 9783319778723; 3319778722
• Related ISBNs: 9783319778716; 3319778714
• Notes: Note: Includes bibliographical references.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.