Die-Attach Materials for High Temperature Applications in Microelectronics Packaging : Materials, Processes, Equipment, and Reliability /: Materials, Processes, Equipment, and Reliability. ([2019])

• Record Type: Book
• Further Information: Note: Editor, Kim S. Siow.
• Editors: Siow, Kim S
• Contents: INemi High Temperature Pb-Free Attach Material.- Historical Context & Processing of Sintered Ag.- Ag Sintering and Solder Solidification.- Sintered Silver for LED Applications.- Equipment and Automation of Sintering Silver En-Masse.- Development and Process Control of Sintered Ag in Production.- Thermal Mechanical Modeling for Sintered Silver and Solder Alloy.- Reliability and Failure Mechanism of Sintered Ag in Power Modules.- The compatibility and selectivity of Ag sintering die attach with various surface metallization.- Morphological changes in sintered silver due to atomic migration.- Electrical properties of sintered Ag and its relationship to microstructural evolution.- High Temperature Solder alloy for die attach.- Transient liquid phase bonding.- Sintered copper.
• Publisher Details: Cham, Switzerland : Springer
• Publication Date: 2019
• Extent: 1 online resource
• Subjects: 621.381046; Microelectronic packaging; TECHNOLOGY & ENGINEERING / Mechanical; Electronic books
• Languages: English
• ISBNs: 9783319992563; 3319992562
• Related ISBNs: 9783319992556
• Notes: Note: Includes bibliographical references and index.; Note: Online resource; title from PDF title page (EBSCO, viewed February 4, 2019).; Note: Vendor-supplied metadata.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.