Introduction to microsystem packaging technology. (©2011)

• Record Type: Book
• Further Information: Note: Yufeng Jin, Zhiping Wang, Jing Chen.
• Other Names: Jin, Yufeng; Wang, Zhiping, 1962 October 6; Chen, Jing, 1974-
• Contents: Ch. 1. Introduction -- ch. 2. Design technique for microsystems packaging and integration -- ch. 3. Substrate technology -- ch. 4. Interconnection technology -- ch. 5. Device-level packaging -- ch. 6. MEMS packaging -- ch. 7. Module assembly and optoelectronic packaging -- ch. 8. System-level packaging technology -- ch. 9. Reliability -- ch. 10. Prospects for microsystems packaging technology.
• Publisher Details: Boca Raton, FL : CRC Press/Taylor & Francis
• Publication Date: 2011
• Copyright Date: 2011
• Extent: 1 online resource (xiii, 218 pages), illustrations
• Subjects: 621.381/046; Microelectronic packaging; TECHNOLOGY & ENGINEERING -- Electronics -- Digital; TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics; Microelectronic packaging; Electronic books
• Languages: English
• ISBNs: 9781439865972; 1439865973; 9781628706727; 1628706724
• Related ISBNs: 9781439819104; 1439819106
• Notes: Note: Includes bibliographical references and index.; Note: Print version record.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.