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3. (Invited) Pixel-Parallel 3-D Integrated CMOS Image Sensors for Next-Generation Video Systems. (10th April 2018)

4. (Invited) Pixel-Parallel CMOS Image Sensors with 16-Bit A/D Converters Developed by 3-D Integration of SOI Layers with Au/SiO2 Hybrid Bonding. (25th April 2016)

5. (Invited) Ultralow-Voltage Design and Technology of Silicon-on Thin-Buried-Oxide (SOTB) CMOS for High Energy Efficient Electronics in IoT Era. (27th March 2015)

9. Au / SiO2 Hybrid Bonding with 6-μm-Pitch Au Electrodes for 3D Structured Image Sensors. (24th August 2016)