Au / SiO2 Hybrid Bonding with 6-μm-Pitch Au Electrodes for 3D Structured Image Sensors. (24th August 2016)

• Record Type: Journal Article
• Authors: Honda, Yuki; Hagiwara, Kei; Goto, Masahide; Watabe, Toshihisa; Nanba, Masakazu; Iguchi, Yoshinori; Saraya, Takuya; Kobayashi, Masaharu; Toshiyoshi, Hiroshi; Higurashi, Eiji; Hiramoto, Toshiro
• Is Part Of: ECS transactions. Volume 75:Number 9(2016)
• Page Start: 103
• Page End: 106
• Publication Date: 2016-08-24
• Subjects: Electrochemistry -- Periodicals; Electrochemistry; Periodicals; Electronic journals; Electronic journal; 541.37
• DOI: 10.1149/07509.0103ecst
• Languages: English
• ISSNs: 1938-5862

Abstract

Abstract : A 3D structured CMOS image sensor that can process signals pixel-wise in parallel is investigated as a means to simultaneously increase the pixel count and the frame rate. To make the pixel pitch finer, the Au electrode dimension is reduced to a 6-μm pitch that is electrically interconnected using a direct-bonding technique. We also develop a daisy-chain test device to examine the numerous interconnections. The experimental results show that the series of electrical interconnections exceeds 230, 000 contacts, with the Au contact resistance for a single connection being ~23.6 mΩ.