1. 3D integration of resistive switching memory. (2023) Authors: Luo, Qing Editors: Luo, Qing, 1988- Record Type: Book Extent: 1 online resource (128 pages), illustrations (black and white) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. 3D Stacked Chips : From Emerging Processes to Heterogeneous Systems /: From Emerging Processes to Heterogeneous Systems. (2016) Editors: Elfadel, Ibrahim (Abe); Fettweis, Gerhard Other Names: École nationale supérieure des beaux-arts (France) Record Type: Book Extent: 1 online resource, illustrations View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Arbitrary modeling of TSVs for 3D integrated circuits. (2015) Authors: Salah, Mohammed Record Type: Book Extent: 1 online resource (181 pages), illustrations (some color) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Design of 3D integrated circuits and systems. (2014) Editors: Sharma, Rohit Record Type: Book Extent: 1 online resource View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Design of 3D integrated circuits and systems. (2018) Editors: Sharma, Rohit Record Type: Book Extent: 1 online resource (324 pages), (125 illustrations) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. FinFET modeling for IC simulation and design : using the BSIM-CMG standard /: using the BSIM-CMG standard. (2015) Authors: Chauhan, Yogesh; Lu, Darsen Duane; Sriramkumar, Vanugopalan; Khandelwal, Sourabh; Duarte, Juan Pablo; Payvadosi, Navid; Niknejad, Ai; Hu, Chenming Record Type: Book Extent: 1 online resource, illustrations View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Substrate, interconnects, noise immunity, and electro-thermal analysis in bulk silicon technology for three-dimensional circuits. (2019) Authors: (Electronics engineer), Ma, Yue; Gontrand, Christian Record Type: Book Extent: 1 online resource, illustrations (black and white) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Through Silicon Vias : Materials, Models, Design, and Performance /: Materials, Models, Design, and Performance. (2016) Authors: Kaushik, Brajesh Kumar; Kumar, Vobulapuram Ramesh; Majumder, Manoj Kumar; Alam, Arsalan Record Type: Book Extent: 1 online resource, illustrations View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Through silicon vias : materials, models, design, and performance /: materials, models, design, and performance. (2016) Authors: Kaushik, Brajesh Kumar; Ramesh Kumar, Vobulapuram; Majumder, Manoj Kumar; Alam, Arsalan Record Type: Book Extent: 1 online resource, illustrations (black and white, and colour) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. TSV 3D RF integration : high resistivity Si interposer technology /: high resistivity Si interposer technology. (2022) Authors: Ma, Shenglin; Jin, Yufeng Record Type: Book Extent: 1 online resource View Content: Available online (eLD content is only available in our Reading Rooms) ↗