Substrate, interconnects, noise immunity, and electro-thermal analysis in bulk silicon technology for three-dimensional circuits. (2019)
- Record Type:
- Book
- Title:
- Substrate, interconnects, noise immunity, and electro-thermal analysis in bulk silicon technology for three-dimensional circuits. (2019)
- Main Title:
- Substrate, interconnects, noise immunity, and electro-thermal analysis in bulk silicon technology for three-dimensional circuits
- Further Information:
- Note: Yue Ma and Christian Gontrand.
- Authors:
- (Electronics engineer), Ma, Yue
Gontrand, Christian - Contents:
- General Information, Substrate Noise in Mixed-Signal Ic’s in a Silicon Process, Efficient and Simple Compact Modeling of Interconnects, Electro-Thermal Modeling of Substrate, Substrate noise and parasites: towards 3D, General Conclusion, References, Index
- Edition:
- 1st
- Publisher Details:
- Boca Raton : CRC Press
- Publication Date:
- 2019
- Extent:
- 1 online resource, illustrations (black and white)
- Subjects:
- 621.381531
Three-dimensional integrated circuits - Languages:
- English
- ISBNs:
- 9780429680069
9780429680076
9780429680052
9780429399619 - Related ISBNs:
- 9780367023430
- Notes:
- Note: Description based on CIP data; resource not viewed.
- Access Rights:
- Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
- Access Usage:
- Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library HMNTS - ELD.DS.423327
- Ingest File:
- 02_532.xml