Through silicon vias : materials, models, design, and performance /: materials, models, design, and performance. (2016)
- Record Type:
- Book
- Title:
- Through silicon vias : materials, models, design, and performance /: materials, models, design, and performance. (2016)
- Main Title:
- Through silicon vias : materials, models, design, and performance
- Further Information:
- Note: Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam.
- Authors:
- Kaushik, Brajesh Kumar
Ramesh Kumar, Vobulapuram
Majumder, Manoj Kumar
Alam, Arsalan - Contents:
- 3D Technology and Packaging Techniques . Introduction. Packaging techniques of future ICs. Integrated architectures. Summary. Through Silicon Vias: Materials, Properties and Fabrication . Introduction. History of graphene material. Carbon nanotube. Graphene nanoribbon. Properties of TSV. Fabrication of TSVs. Challenges for the TSV implementations. Summary. Copper Based TSVs . Introduction. Physical configuration. Modelling of Cu based TSVs. Performance analysis of Cu based TSVs. Summary. Carbon Nanotube Based TSVs . Introduction. Physical configuration. Modelling. Performance analysis of CNT based TSVs. Summary. Mixed CNT Bundled Based TSVs . Introduction. Configurations of mixed CNT bundled TSVs. Modelling of MCB based TSVs. Signal integrity analysis of MCB based TSVs. Summary. Graphene Nanoribbon Based TSVs. Introduction. Configurations of GNR based TSVs. Fabrication challenges and limitations. Modelling of GNR based TSVs with smooth edges. Modelling of GNR based TSVs with rough edges. Signal integrity analysis of GNR based TSVs. Summary. Liners in TSVs . Introduction. Types of liners and their impact on performance. Fabrication challenges. Modelling of CNT bundled TSV with SiO2 and polymer liners. Impact of polymer liners on delay. Summary.
- Publisher Details:
- Boca Raton : CRC Press
- Publication Date:
- 2016
- Extent:
- 1 online resource, illustrations (black and white, and colour)
- Subjects:
- 621.395
Interconnects (Integrated circuit technology)
Three-dimensional integrated circuits - Languages:
- English
- ISBNs:
- 9781498745536
- Notes:
- Note: Description based on CIP data; resource not viewed.
- Access Rights:
- Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
- Access Usage:
- Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
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- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library HMNTS - ELD.DS.102602
- Ingest File:
- 02_016.xml