TSV 3D RF integration : high resistivity Si interposer technology /: high resistivity Si interposer technology. (2022)
- Record Type:
- Book
- Title:
- TSV 3D RF integration : high resistivity Si interposer technology /: high resistivity Si interposer technology. (2022)
- Main Title:
- TSV 3D RF integration : high resistivity Si interposer technology
- Further Information:
- Note: Shenglin Ma, Yufeng Jin.
- Authors:
- Ma, Shenglin
Jin, Yufeng - Contents:
- 1. Introduction to HR-Si Interposer Technology 2. Design, process and electrical verification of HR-Si interposer 3. Design, verification and optimization of novel vertical RF transmission structure in HR-Si interposer 4. HR-Si TSV integrated inductor 5. Verification of 2.5D/3D heterogeneous RF integration of HR-Si interposer 6. 3D heterogeneous RF integration oriented HR-Si interposer embedded with microchannel 7. Patch Antenna in Stacked HR-Si interposers 8. Through Glass Via Technology 9. Conclusion and outlook
- Publisher Details:
- Amsterdam : Elsevier
- Publication Date:
- 2022
- Extent:
- 1 online resource
- Subjects:
- 621.3815
Three-dimensional integrated circuits
Silicon -- Electric properties
Radio frequency integrated circuits - Languages:
- English
- ISBNs:
- 9780323996037
- Related ISBNs:
- 9780323996020
- Notes:
- Note: Description based on CIP data; resource not viewed.
- Access Rights:
- Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
- Access Usage:
- Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library HMNTS - ELD.DS.694079
- Ingest File:
- 12_025.xml