Design of 3D integrated circuits and systems. (2014)

• Record Type: Book
• Further Information: Note: Editor, Rohit Sharma.
• Editors: Sharma, Rohit
• Contents: Preface About the Editors Contributors 3D Integration Technology with TSV and IMC Bonding; Katsuyuki Sakuma Wafer-Level Three-Dimensional ICs for Advanced CMOS Integration; Ronald J. Gutmann and Jian-Qiang Lu Integration of Graphics Processing Cores with Microprocessors; Deepak C. Sekar and Chinnakrishnan Ballapuram Electrothermal Simulation of Three-Dimensional Integrated Circuits; Shivam Priyadarshi, Jianchen Hu, Michael B. Steer, Paul D. Franzon, and W. Rhett Davis Thermal Management in 3D ICs/Systems; Francesco Zanini Emerging Interconnect Technologies for 3D Networks-on-Chip; Rohit Sharma and Kiyoung Choi Inductive-Coupling ThruChip Interface for 3D Integration; Noriyuki Miura and Tadahiro Kuroda Fabrication and Modeling of Copper and Carbon Nanotube-Based Through-Silicon Via; Brajesh Kumar Kaushik, Manoj Kumar Majumder, and Archana Kumari Low-Power Testing for 2D/3D Devices and Systems; Xijiang Lin, Xiaoqing Wen, and Dong Xiang
• Edition: 1st
• Publisher Details: Boca Raton : CRC Press
• Publication Date: 2014
• Extent: 1 online resource
• Subjects: 621.3815; Three-dimensional integrated circuits; Three-dimensional integrated circuits -- Design and construction
• Languages: English
• ISBNs: 9781466589421
• Related ISBNs: 9781466589407
• Notes: Note: Includes bibliographical references and index.; Note: Description based on CIP data; item not viewed.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.