Arbitrary modeling of TSVs for 3D integrated circuits. (2015)

• Record Type: Book
• Further Information: Note: Khaled Salah, Yehea Ismail, Alaa El-Rouby.
• Authors: Salah, Mohammed
• Contents: Introduction: Work around Moore's Law -- 3D/TSV Enabling Technologies -- TSV Modeling and Analysis -- TSV Verification -- TSV Macro-Modeling Framework -- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter -- Imperfection in TSV Modeling -- New Trends in TSV -- TSV Fabrication -- Conclusions.
• Publisher Details: Cham, Switzerland Heidelberg [Germany] : Springer International Publishing
• Publication Date: 2015
• Copyright Date: 2015
• Extent: 1 online resource (181 pages), illustrations (some color)
• Subjects: 621.3815; Engineering; Three-dimensional integrated circuits; Three-dimensional integrated circuits -- Mathematical models; Systems engineering; Electronics; Computer science; Three-dimensional integrated circuits; Technology & Engineering -- Electronics -- General; Computers -- Systems Architecture -- General; Electronics engineering; Computer architecture & logic design; Technology & Engineering -- Electronics -- Circuits -- General; Circuits & components; Electronic books
• Languages: English
• ISBNs: 9783319076119; 3319076116; 3319076108; 9783319076102
• Related ISBNs: 9783319076102
• Notes: Note: Includes bibliographical references and index.; Note: Print version record.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.