1. BS EN IEC 61189-2-805. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-805. X/Y CTE Test for Thin Base Materials by TMA (18th December 2020) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (11 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-808. Thermal resistance of an assembly by thermal transient method (29th October 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (18 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-809. X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (30th July 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (10 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. BS EN IEC 61189-5-301. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-301. Test methods for printed board assemblies. Soldering paste using fine solder particles (8th November 2019) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (33 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. BS EN IEC 61189-5-301. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-301. Test methods for printed board assemblies. Soldering paste using fine solder particles (10th August 2020) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (35 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. BS EN IEC 61249-2-51. Materials for printed boards and other interconnecting structures. Part 2-51. Reinforced base materials; clad and unclad. Base materials for Integrated Circuit card carrier tape; unclad (30th July 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (15 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. BS IEC 61189-2-807 Ed.1.0. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-807. Test methods for materials for interconnection structures. Decomposition Temperature (Td) using TGA (22nd April 2020) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (10 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad Part 2-51, (22nd June 2023) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (22 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Printed board assemblies. Application and utilization of protective coatings for electronic assemblies Part 10, (13th September 2022) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (214 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Printed board assemblies. Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices Part 8, (25th March 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (38 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗