1. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards Part 5-601, (19th March 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (46 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Printed board assemblies. Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices Part 8, (25th March 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (38 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste using fine solder particles Part 5-301, (6th May 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (38 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. BS EN IEC 61189-5-301. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-301. Test methods for printed board assemblies. Soldering paste using fine solder particles (8th November 2019) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (33 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. BS IEC 61189-2-807 Ed.1.0. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-807. Test methods for materials for interconnection structures. Decomposition Temperature (Td) using TGA (22nd April 2020) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (10 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. BS EN IEC 61189-5-301. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-301. Test methods for printed board assemblies. Soldering paste using fine solder particles (10th August 2020) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (35 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501 Part 5-506, (18th July 2019) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (26 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. BS EN IEC 61249-2-51. Materials for printed boards and other interconnecting structures. Part 2-51. Reinforced base materials; clad and unclad. Base materials for Integrated Circuit card carrier tape; unclad (30th July 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (15 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-809. X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (30th July 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (10 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Decomposition temperature (T d ) using TGA Part 2-807, (5th November 2021) Authors: British Standards Institution, Record Type: Book Extent: 1 online resource (14 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗