BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-809. X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (30th July 2021)

Record Type:
Book
Title:
BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-809. X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (30th July 2021)
Main Title:
BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures and assemblies.
Authors:
British Standards Institution,
Publisher Details:
London : British Standards Institution
Publication Date:
2021
Extent:
1 online resource (10 pages)
Subjects:
602.1841
Materials by form
Printed-wiring boards
Printing board
Boards
Board (paper)
Languages:
English
ISSNs:
3044-1791
Access Rights:
Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:
Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:
British Library HMNTS - ELD.DS.629225
Ingest File:
05_041.xml