BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-808. Thermal resistance of an assembly by thermal transient method (29th October 2021)

Record Type:
Book
Title:
BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-808. Thermal resistance of an assembly by thermal transient method (29th October 2021)
Main Title:
BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies.
Authors:
British Standards Institution,
Publisher Details:
London : British Standards Institution
Publication Date:
2021
Extent:
1 online resource (18 pages)
Subjects:
602.1841
Printing board
Structures
Testing methods
Open systems interconnection
Languages:
English
ISSNs:
3044-6636
Access Rights:
Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:
Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:
British Library HMNTS - ELD.DS.649111
Ingest File:
07_014.xml