BS IEC 61189-2-807 Ed.1.0. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-807. Test methods for materials for interconnection structures. Decomposition Temperature (Td) using TGA (22nd April 2020)

Record Type:: Book
Title:: BS IEC 61189-2-807 Ed.1.0. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-807. Test methods for materials for interconnection structures. Decomposition Temperature (Td) using TGA (22nd April 2020)
Main Title:: BS IEC 61189-2-807 Ed.1.0. Test methods for electrical materials, printed board and other interconnection structures and assemblies.
Authors:: British Standards Institution,
Publisher Details:: London : British Standards Institution
Publication Date:: 2020
Extent:: 1 online resource (10 pages)
Subjects:: 602.1841
Testing methods
Printing board
Open systems interconnection
Structures
Languages:: English
ISSNs:: 3040-9140
Access Rights:: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:: British Library HMNTS - ELD.DS.544684
Ingest File:: 03_156.xml