BS EN IEC 61189-5-301. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-301. Test methods for printed board assemblies. Soldering paste using fine solder particles (8th November 2019)

Record Type:: Book
Title:: BS EN IEC 61189-5-301. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-301. Test methods for printed board assemblies. Soldering paste using fine solder particles (8th November 2019)
Main Title:: BS EN IEC 61189-5-301. Test methods for electrical materials, printed boards and other interconnection structures and assemblies.
Authors:: British Standards Institution,
Publisher Details:: London : British Standards Institution
Publication Date:: 2019
Extent:: 1 online resource (33 pages)
Subjects:: 602.1841
Test methods
Printing board
Solders
Structures
Assembly
Languages:: English
ISSNs:: 3040-2793
Access Rights:: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
Access Usage:: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:: British Library HMNTS - ELD.DS.541782
Ingest File:: 03_151.xml