Is Part Of: Microelectronics and reliability. Volume 55:Issue 1(2015) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Microelectronics and reliability. Volume 55:Issue 1(2015)

1. A cloud model-based method for the analysis of accelerated life test data. Issue 1 (January 2015)

Authors:: Zhang, Wenjin; Liu, Shunli; Sun, Bo; Liu, Yue; Pecht, Michael
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 1(2015)
Page Start:: 123
Record Type:: Journal Article
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2. An advanced area scaling approach for semiconductor burn-in. Issue 1 (January 2015)

Authors:: Kurz, Daniel; Lewitschnig, Horst; Pilz, Jürgen
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 1(2015)
Page Start:: 129
Record Type:: Journal Article
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3. An analytical avalanche breakdown model for double gate MOSFET. Issue 1 (January 2015)

Authors:: Cho, Edward Namkyu; Shin, Yong Hyeon; Yun, Ilgu
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 1(2015)
Page Start:: 38
Record Type:: Journal Article
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4. Call for Papers: Reliability Issues in Power Electronics. Issue 1 (January 2015)

Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 1(2015)
Page Start:: 292
Record Type:: Journal Article
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5. Characterizing, modeling, and analyzing soft error propagation in asynchronous and synchronous digital circuits. Issue 1 (January 2015)

Authors:: Bany Hamad, Ghaith; Hasan, Syed Rafay; Ait Mohamed, Otmane; Savaria, Yvon
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 1(2015)
Page Start:: 238
Record Type:: Journal Article
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6. Compact failure modeling for devices subject to electrostatic discharge stresses – A review pertinent to CMOS reliability simulation. Issue 1 (January 2015)

Authors:: Miao, Meng; Zhou, Yuanzhong; Salcedo, Javier A.; Hajjar, Jean-Jacques; Liou, Juin J.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 1(2015)
Page Start:: 15
Record Type:: Journal Article
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7. Copper wire bonding package decapsulation using the anodic protection method. Issue 1 (January 2015)

Authors:: Endoh, Hirohiko; Naoe, Takuya
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 1(2015)
Page Start:: 207
Record Type:: Journal Article
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8. Corrigendum to "Junction temperature management of IGBT module in power electronic converters" [Microelectron. Reliab. 54 (2014) 2788–2795]. Issue 1 (January 2015)

Authors:: Zhou, Luowei; Wu, Junke; Sun, Pengju; Du, Xiong
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 1(2015)
Page Start:: 291
Record Type:: Journal Article
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9. Crosstalk noise modeling of multiwall carbon nanotube (MWCNT) interconnects using finite-difference time-domain (FDTD) technique. Issue 1 (January 2015)

Authors:: Ramesh Kumar, Vobulapuram; Kaushik, Brajesh Kumar; Patnaik, Amalendu
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 1(2015)
Page Start:: 155
Record Type:: Journal Article
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10. CSAM: A clock skew-aware aging mitigation technique. Issue 1 (January 2015)

Authors:: Eghbalkhah, Behzad; Kamal, Mehdi; Afzali-Kusha, Ali; Ghaznavi-Ghoushchi, Mohammad Bagher; Pedram, Massoud
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 1(2015)
Page Start:: 282
Record Type:: Journal Article
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