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2. (Invited) Challenges on Surface Conditioning in 3D Device Architectures: Triple-Gate FinFETs, Gate-All-Around Lateral and Vertical Nanowire FETs. (15th August 2017)

5. (Invited) Generation-Recombination Noise in Advanced CMOS Devices. (19th August 2016)

6. (Invited) Heterogeneous Nano- to Wide-Scale Co-Integration of Beyond-Si and Si CMOS Devices to Enhance Future Electronics. (31st March 2015)

8. (Invited) Stress Simulations of Fins, Wires, and Nanosheets. (8th September 2020)

9. (Invited) Vertical Nanowire FET Integration and Device Aspects. (4th May 2016)