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You searched for: Author/Creator Goto, Masahide

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1. (Invited) Pixel-Parallel 3-D Integrated CMOS Image Sensors for Next-Generation Video Systems. (10th April 2018)

2. (Invited) Pixel-Parallel CMOS Image Sensors with 16-Bit A/D Converters Developed by 3-D Integration of SOI Layers with Au/SiO2 Hybrid Bonding. (25th April 2016)

6. Au / SiO2 Hybrid Bonding with 6-μm-Pitch Au Electrodes for 3D Structured Image Sensors. (24th August 2016)

7. Efficient detection of copy‐number variations using exome data: Batch‐ and sex‐based analyses. Issue 1 (11th November 2020)

8. Ethynylene-linked multifunctional benzoxazines: the effect of the ethynylene group and packing on thermal behavior. Issue 39 (7th September 2022)

9. Fabrication of 3-Layer Stacked Pixel for Pixel-Parallel CMOS Image Sensors by Au/SiO2 Hybrid Bonding of SOI Wafers. (8th September 2020)