1. Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding. (8th September 2020) Authors: Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Sleeckx, Erik; De Gendt, Stefan; Beyer, Gerald; Beyne, Eric Journal: ECS transactions Issue: Volume 98:Number 4(2020) Page Start: 21 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Effect of test structure on electromigration characteristics in three-dimensional through silicon via stacked devices. (17th April 2015) Authors: Oba, Yoshiyuki; De Messemaeker, Joke; Tyrovouzi, Anna Maria; Miyamori, Yuichi; De Vos, Joeri; Wang, Teng; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof Journal: Japanese journal of applied physics Issue: Volume 54:Number 5(2015:May)Supplement Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking. (November 2019) Authors: Panchenko, Iuliana; Wolter, Klaus-Juergen; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Beyne, Eric; Wolf, M. Juergen Journal: Microelectronics and reliability Issue: Volume 102(2019) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly. (August 2018) Authors: Lofrano, Melina; Cherman, Vladimir; Gonzalez, Mario; Beyne, Eric Journal: Microelectronics and reliability Issue: Volume 87(2018) Page Start: 97 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Epitaxial Growth of Active Si on Top of SiGe Etch Stop Layer in View of 3D Device Integration. (8th September 2020) Authors: Loo, Roger; Jourdain, Anne; Rengo, Gianluca; Porret, Clement; Hikavyy, Andriy Yakovitch; Liebens, Maarten; Becker, Lucas; Storck, Peter; Beyer, Gerald; Beyne, Eric Journal: ECS transactions Issue: Volume 98:Number 4(2020) Page Start: 157 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration. (20th January 2021) Authors: Inoue, Fumihiro; Derakhshandeh, Jaber; Lofrano, Melina; Beyne, Eric Journal: Japanese journal of applied physics Issue: Volume 60:Number 2(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Heat transfer and pressure drop correlations for direct on-chip microscale jet impingement cooling with alternating feeding and draining jets. (January 2022) Authors: Wei, Tiwei; Oprins, Herman; Fang, Liang; Cherman, Vladimir; Beyne, Eric; Baelmans, M. Journal: International journal of heat and mass transfer Issue: Volume 182(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. (December 2017) Authors: Ključar, Luka; González, Mario; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Murdoch, Gayle; Nolmans, Philip; De Vos, Joeri; Bömmels, Jürgen; Beyne, Eric; Tőkei, Zsolt Journal: Microelectronics and reliability Issue: Volume 79(2017) Page Start: 297 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding. (19th June 2019) Authors: Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Phommahaxay, Alain; Verdonck, Patrick; Meersschaut, Johan; Dara, Praveen; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric Journal: ECS journal of solid state science and technology Issue: Volume 8:Number 6(6019) Page Start: P346 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding. (1st January 2019) Authors: Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Phommahaxay, Alain; Verdonck, Patrick; Meersschaut, Johan; Dara, Praveen; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric Journal: ECS journal of solid state science and technology Issue: Volume 8:Number 6(6019) Page Start: P346 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗