Cite
MLA Citation
Yan Li et al., editors. 3D microelectronic packaging : from fundamentals to applications. Cham, Switzerland : Springer, 2017. http://access.bl.uk/ark:/81055/vdc_100071524177.0x000001
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Yan Li et al., editors. 3D microelectronic packaging : from fundamentals to applications. Cham, Switzerland : Springer, 2017. http://access.bl.uk/ark:/81055/vdc_100071524177.0x000001