3D microelectronic packaging : from fundamentals to applications /: from fundamentals to applications. (2017)

• Record Type: Book
• Further Information: Note: Yan Li, Deepak Goyal, editors.
• Editors: Li, Yan; Goyal, Deepak
• Contents: Introduction to 3D Microelectronic Packaging -- 3D packaging architecture and assembly process design -- Materials and Processing of TSV -- Microstructural and Reliability Issues of TSV -- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging -- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages -- Fundamentals of solder alloys in 3D packaging -- Fundamentals of Electromigration in interconnects of 3D packages -- Fundamentals of heat dissipation in 3D IC packaging -- Fundamentals of advanced materials and processes in organic substrate technology -- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization -- Processing and Reliability of Solder Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation and failure analysis of 3D packaging.
• Publisher Details: Cham, Switzerland : Springer
• Publication Date: 2017
• Extent: 1 online resource
• Subjects: 621.381; Engineering; Microelectronics -- Packaging; TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics; Biotechnology; Electronic circuits; Electronics; Electronics -- Materials; Engineering; Metals; Microelectronics; Nanotechnology; Optical materials; Engineering; Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Electronic Circuits and Devices; Microengineering; Nanotechnology and Microengineering; Metallic Materials; Technology & Engineering -- Material Science; Technology & Engineering -- Electronics -- Circuits -- General; Science -- Biotechnology; Technology & Engineering -- Nanotechnology & MEMS; Electronic devices & materials; Circuits & components; Chemical engineering; Precision instruments manufacture; Metals technology / metallurgy; Electronics; Optical materials; Microreactors; Materials; Technology & Engineering -- Electronics -- General; Electronics engineering; Electronic books; Electronic book
• Languages: English
• ISBNs: 9783319445861; 3319445863; 3319445847; 9783319445847
• Related ISBNs: 9783319445847
• Notes: Note: Includes bibliographical references and index.; Note: Online resource; title from PDF title page (SpringerLink, viewed February 7, 2017).
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.