Cite
HARVARD Citation
Li, Y. et al. (eds.) (2017) 3D microelectronic packaging : from fundamentals to applications. [Online]. Cham, Switzerland : Springer. Available from: http://access.bl.uk/ark:/81055/vdc_100071524177.0x000001
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Li, Y. et al. (eds.) (2017) 3D microelectronic packaging : from fundamentals to applications. [Online]. Cham, Switzerland : Springer. Available from: http://access.bl.uk/ark:/81055/vdc_100071524177.0x000001