Cite
APA Citation
Li, Y., & Goyal, D. (Eds.) (2017). 3D microelectronic packaging : from fundamentals to applications. Cham, Switzerland : Springer. http://access.bl.uk/ark:/81055/vdc_100071524177.0x000001
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Li, Y., & Goyal, D. (Eds.) (2017). 3D microelectronic packaging : from fundamentals to applications. Cham, Switzerland : Springer. http://access.bl.uk/ark:/81055/vdc_100071524177.0x000001