Is Part Of: Microelectronics and reliability. Volume 59(2016) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Microelectronics and reliability. Volume 59(2016)

1. A thermal cycling reliability study of ultrasonically bonded copper wires. (April 2016)

Authors:: Arjmand, Elaheh; Agyakwa, Pearl A.; Corfield, Martin R.; Li, Jianfeng; Mouawad, Bassem; Mark Johnson, C.
Journal:: Microelectronics and reliability
Issue:: Volume 59(2016)
Page Start:: 126
Record Type:: Journal Article
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2. An improved modeling for life prediction of high-power white LED based on Weibull right approximation method. (April 2016)

Authors:: Zhang, Jianping; Chen, Wenlong; Wang, Chen; Chen, Xiao; Cheng, Guoliang; Qiu, Yingji; Wu, Helen
Journal:: Microelectronics and reliability
Issue:: Volume 59(2016)
Page Start:: 49
Record Type:: Journal Article
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3. Analysis of origin of measured 1/f noise in high-power semiconductor laser diodes far below threshold current. (April 2016)

Authors:: Guan, Jian; Guo, Shuxu; Wang, Jinyuan; Tao, Min; Cao, Junsheng; Gao, Fengli
Journal:: Microelectronics and reliability
Issue:: Volume 59(2016)
Page Start:: 55
Record Type:: Journal Article
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4. B-Spline X-Ray Diffraction Imaging — Rapid non-destructive measurement of die warpage in ball grid array packages. (April 2016)

Authors:: Cowley, A.; Ivankovic, A.; Wong, C.S.; Bennett, N.S.; Danilewsky, A.N.; Gonzalez, M.; Cherman, V.; Vandevelde, B.; De Wolf, I.; McNally, P.J.
Journal:: Microelectronics and reliability
Issue:: Volume 59(2016)
Page Start:: 108
Record Type:: Journal Article
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5. Book Review. (April 2016)

Authors:: Gan, Chong Leong
Journal:: Microelectronics and reliability
Issue:: Volume 59(2016)
Page Start:: 140
Record Type:: Journal Article
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6. Creep fatigue models of solder joints: A critical review. (April 2016)

Authors:: Wong, E.H.; van Driel, W.D.; Dasgupta, A.; Pecht, M.
Journal:: Microelectronics and reliability
Issue:: Volume 59(2016)
Page Start:: 1
Record Type:: Journal Article
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7. Degradation of pMOSFETs due to hot electron induced punchthrough. (April 2016)

Authors:: Son, Donghee; Kim, Gang-Jun; Seo, Ji-Hoon; Lee, Nam-Hyun; Kang, YongHa; Kang, Bongkoo
Journal:: Microelectronics and reliability
Issue:: Volume 59(2016)
Page Start:: 13
Record Type:: Journal Article
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8. Degradation study of single poly radiation sensors by monitoring charge trapping. (April 2016)

Authors:: Pikhay, Evgeny; Roizin, Yakov; Nemirovsky, Yael
Journal:: Microelectronics and reliability
Issue:: Volume 59(2016)
Page Start:: 18
Record Type:: Journal Article
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9. Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip–package interaction; a numerical investigation. (April 2016)

Authors:: Zahedmanesh, Houman; Gonzalez, Mario; Ciofi, Ivan; Croes, Kristof; Bömmels, Jürgen; Tőkei, Zsolt
Journal:: Microelectronics and reliability
Issue:: Volume 59(2016)
Page Start:: 102
Record Type:: Journal Article
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10. Drain current model for double-gate tunnel field-effect transistor with hetero-gate-dielectric and source-pocket. (April 2016)

Authors:: Wang, Ping; Zhuang, YiQi; Li, Cong; Jiang, Zhi; Liu, YuQi
Journal:: Microelectronics and reliability
Issue:: Volume 59(2016)
Page Start:: 30
Record Type:: Journal Article
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