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14. Au / SiO2 Hybrid Bonding with 6-μm-Pitch Au Electrodes for 3D Structured Image Sensors. (24th August 2016)

20. Fabrication of 3-Layer Stacked Pixel for Pixel-Parallel CMOS Image Sensors by Au/SiO2 Hybrid Bonding of SOI Wafers. (8th September 2020)