Evaluation and modeling of adhesion layer in shock-protection structure for MEMS accelerometer. (November 2016)

• Record Type: Journal Article
• Authors: Yamane, Daisuke; Konishi, Toshifumi; Safu, Teruaki; Toshiyoshi, Hiroshi; Sone, Masato; Masu, Kazuya; Machida, Katsuyuki
• Is Part Of: Microelectronics and reliability. Volume 66(2016)
• Page Start: 78
• Page End: 84
• Publication Date: 2016-11
• Subjects: Shock-protection -- MEMS -- Accelerometer -- Multi-layer metal -- Multi-physics simulation; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2016.09.018
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: This paper presents evaluation and modeling of adhesion layer in shock-protection structure for a MEMS accelerometer fabricated by the multi-layer metal technology. The shock-protection structure is used to limit the proof-mass displacement at the input of excess acceleration. To clarify the mechanical characteristics of the shock-protection structure, we investigate the relationship between the input acceleration and the adhesion force on the adhesion layer in the multi-layer metal structure. For the multi-physics simulation, we propose an equivalent circuit model for a shock-protection module combined with the acceleration module. The adhesion force on the adhesion layer is examined by tensile tests in order to obtain the simulation parameters. The multi-physics simulation results are consistent with the measured capacitance-acceleration characteristics. The transient and capacitance-acceleration simulations at the input of high acceleration are also demonstrated to show the non-linear behavior of the shock-protection structure. Therefore, it is confirmed that the proposed module is useful for the multi-physics simulation to analyze the shock tolerance. Highlights: An equivalent circuit model of a shock-protection structure module is proposed. The module is implemented in a multi-physics simulation platform. Multi-physics simulation results are consistent with measurement data. Transient and C-G simulations with high input acceleration are demonstrated. The module is useful to analyze the shock tolerance of MEMS accelerometer.