1. Adsorption isotherm and kinetic study of gas-solid system of formaldehyde on oil palm mesocarp bio-char: Pyrolysis effect. Issue 1 (February 2018) Authors: Abdul Manap, Nor Rahafza; Shamsudin, Roslinda; Maghpor, Mohd Norhafsam; Abdul Hamid, Muhammad Azmi; Jalar, Azman Journal: Journal of environmental chemical engineering Issue: Volume 6:Issue 1(2018) Page Start: 970 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Bondability of ultrasonic Aluminum bonds on the molybdenum (de)selenide and molybdenum of back contact layer of copper indium gallium (de)selenide CIGS thin film photovoltaic solar panel. (1st November 2021) Authors: Basher, Hassan; Zulkifli, Muhammad Nubli; Rahmat, Mohd Khairil; Rahman, Muhammad Ghazali Abdul; Jalar, Azman; Daenen, Michael Journal: Solar energy Issue: Volume 228(2021) Page Start: 516 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Characterization of Oxide Growth on Surface of Al-Mg-Si Welded Joint. (16th February 2014) Authors: Jalar, Azman; Che Lah, Nur Azida; Othman, Norinsan Kamil; Shamsudin, Roslinda; Daud, Abdul Razak; Sayd Bakar, Syed Roslee Other Names: Lejcek Pavel Academic Editor. Journal: Advances in materials science and engineering Issue: Volume 2014(2014) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly. Issue 2 (18th December 2018) Authors: Che Ani, Fakhrozi; Jalar, Azman; Saad, Abdullah Aziz; Khor, Chu Yee; Abas, Mohamad Aizat; Bachok, Zuraihana; Othman, Norinsan Kamil Journal: Soldering & surface mount technology Issue: Volume 31:Issue 2(2019) Page Start: 109 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly. Issue 2 (1st April 2019) Authors: Che Ani, Fakhrozi; Jalar, Azman; Saad, Abdullah Aziz; Khor, Chu Yee; Abas, Mohamad Aizat; Bachok, Zuraihana; Othman, Norinsan Kamil Journal: Soldering & surface mount technology Issue: Volume 31:Issue 2(2019) Page Start: 109 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition. Issue 2 (1st April 2019) Authors: Wan Yusoff, Wan Yusmawati; Ismail, Norliza; Safee, Nur Shafiqa; Ismail, Ariffin; Jalar, Azman; Abu Bakar, Maria Journal: Soldering & surface mount technology Issue: Volume 31:Issue 2(2019) Page Start: 102 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition. Issue 2 (2nd April 2019) Authors: Wan Yusoff, Wan Yusmawati; Ismail, Norliza; Safee, Nur Shafiqa; Ismail, Ariffin; Jalar, Azman; Abu Bakar, Maria Journal: Soldering & surface mount technology Issue: Volume 31:Issue 2(2019) Page Start: 102 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire. Issue 3 (21st December 2017) Authors: Abdullah, Izhan; Zulkifli, Muhammad Nubli; Jalar, Azman; Ismail, R. Journal: Soldering & surface mount technology Issue: Volume 30:Issue 3(2018) Page Start: 194 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire. Issue 3 (4th June 2018) Authors: Abdullah, Izhan; Zulkifli, Muhammad Nubli; Jalar, Azman; Ismail, R. Journal: Soldering & surface mount technology Issue: Volume 30:Issue 3(2018) Page Start: 194 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates. Issue 2 (3rd April 2017) Authors: Abdullah, Izhan; Zulkifli, Muhammad Nubli; Jalar, Azman; Ismail, Roslina Journal: Soldering & surface mount technology Issue: Volume 29:Issue 2(2017) Page Start: 110 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗