Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly. Issue 2 (1st April 2019)

• Record Type: Journal Article
• Authors: Che Ani, Fakhrozi; Jalar, Azman; Saad, Abdullah Aziz; Khor, Chu Yee; Abas, Mohamad Aizat; Bachok, Zuraihana; Othman, Norinsan Kamil
• Is Part Of: Soldering & surface mount technology. Volume 31:Issue 2(2019)
• Page Start: 109
• Page End: 124
• Publication Date: 2019-04-01
• Subjects: SAC305 -- Ultra-fine package -- Nano-reinforced lead-free solder -- Nickel oxide nanoparticle; Brazing -- Periodicals; Solder and soldering -- Periodicals; 671.5605
• DOI: 10.1108/SSMT-08-2018-0024
• Languages: English
• ISSNs: 0954-0911

Abstract

Abstract : Purpose: This study aims to investigate the NiO nano-reinforced solder joint characteristics of ultra-fine electronic package. Design/methodology/approach: Lead-free Sn-Ag-Cu (SAC) solder paste was mixed with various percentages of NiO nanoparticles to prepare the new form of nano-reinforced solder paste. The solder paste was applied to assemble the ultra-fine capacitor using the reflow soldering process. A focussed ion beam, high resolution transmission electron microscopy system equipped with energy dispersive X-ray spectroscopy (EDS) was used in this study. In addition, X-ray inspection system, field emission scanning electron microscopy coupled with EDS, X-ray photoelectron spectroscopy (XPS) and nanoindenter were used to analyse the solder void, microstructure, hardness and fillet height of the solder joint. Findings: The experimental results revealed that the highest fillet height was obtained with the content of 0.01 Wt.% of nano-reinforced NiO, which fulfilled the reliability requirements of the international IPC standard. However, the presence of the NiO in the lead-free solder paste only slightly influenced the changes of the intermetallic layer with the increment of weighted percentage. Moreover, the simulation method was applied to observe the distribution of NiO nanoparticles in the solder joint. Originality/value: The findings are expected to provide a profound understanding of nano-reinforced solder joint's characteristics of the ultra-fine package.