Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition. Issue 2 (2nd April 2019)

• Record Type: Journal Article
• Authors: Wan Yusoff, Wan Yusmawati; Ismail, Norliza; Safee, Nur Shafiqa; Ismail, Ariffin; Jalar, Azman; Abu Bakar, Maria
• Is Part Of: Soldering & surface mount technology. Volume 31:Issue 2(2019)
• Page Start: 102
• Page End: 108
• Publication Date: 2019-04-02
• Subjects: Sn-Ag-Cu solder -- Blast wave -- Microstructure -- Intermetallic layers -- Hardness properties; Brazing -- Periodicals; Solder and soldering -- Periodicals; 671.5605
• DOI: 10.1108/SSMT-06-2018-0019
• Languages: English
• ISSNs: 0954-0911

Abstract

Abstract : Purpose: The purpose of this paper is to discuss the effect of a blast wave on the microstructure, intermetallic layers and hardness properties of Sn0.3Ag0.7Cu (SAC0307) lead-free solder. Design/methodology/approach: Soldered samples were exposed to the blast wave by using trinitrotoluene (TNT) explosive. Microstructure and intermetallic layer thickness were identified using Alicona ® Infinite Focus Measurement software. Hardness properties of investigated solders were determined using a nanoindentation approach. Findings: Microstructure and intermetallic layers changed under blast wave condition. Hardness properties of exposed solders decreased with an increase in the TNT explosive weight. Originality/value: Microstructural evolution and mechanical properties of the exposed solder to the blast wave provide a fundamental understanding on how blast waves can affect the reliability of a solder joint, especially for military applications.