1. A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints. (November 2022) Authors: Ismail, N.; Atiqah, A.; Jalar, A.; Bakar, M.A.; Rahim, R.A.A.; Ismail, A.G.; Hamzah, A.A.; Keng, L.K. Journal: Journal of manufacturing processes Issue: Volume 83(2022) Page Start: 68 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages. (December 2017) Authors: Haslinda, M.S.; Abas, Aizat; Che Ani, F.; Jalar, A.; Saad, A.A.; Abdullah, M.Z. Journal: Microelectronics and reliability Issue: Volume 79(2017) Page Start: 336 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Effect of stencil wall aperture on solder paste release via stencil printing. Issue 1 (1st January 2022) Authors: Mohamed Sunar, M. S.; Abu Bakar, M.; Jalar, A.; Che Ani, F.; Ramli, M. R. Journal: Journal of physics Issue: Volume 2169:Issue 1(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Effects of electrolyte towards copper wire metallurgical interconnection in semiconductor. Issue 1 (1st January 2022) Authors: Abdul Hamid, K.; Badarisman, A. H.; Jalar, A.; Abu Bakar, M. Journal: Journal of physics Issue: Volume 2169:Issue 1(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Effects of molding temperature on delamination of small outline transistor (SOT). Issue 1 (1st January 2022) Authors: Badarisman, A. H.; Abdul Hamid, K.; Ideris, H.; Abu Bakar, M.; Jalar, A. Journal: Journal of physics Issue: Volume 2169:Issue 1(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow. (1st February 2016) Authors: Abdul Aziz, M. S.; Abdullah, M. Z.; Khor, C. Y.; Jalar, A.; Che Ani, F.; yan, Nobe.; Cheok, C. Journal: Numerical heat transfer Issue: Volume 69:Number 3(2016) Page Start: 295 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Influence of Copper Substrate Roughness on the Growth of Intermetallic Compounds Layer in SAC305 Solder Joints. Issue 1 (1st January 2022) Authors: Atiqah, A.; Rahim, R.A.A.A.; Jalar, A.; Siow, K. S. Journal: Journal of physics Issue: Volume 2169:Issue 1(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages. Issue 1 (1st January 2022) Authors: Hamid, K. A.; Badarisman, A. H.; Jalar, A.; Bakar, M. A. Journal: Journal of physics Issue: Volume 2169:Issue 1(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Reduce Wafer Remnants Through Pre-Assembly Process Optimization. Issue 1 (1st January 2022) Authors: Vijayakumaran, P.; Ramli, M. H. M.; Selvam, M.; Hamid, K.; Atiqah, A.; Jalar, A.; Bakar, M. A. Journal: Journal of physics Issue: Volume 2169:Issue 1(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Tapered waveguide design for mode conversion in mode division multiplexing (MDM). Issue 6 (18th August 2021) Authors: Mahadzir, N. A.; Amphawan, A.; Masunda, T.; Menon, P. S.; Jalar, A.; Bakar, M. Abu; Ismail, A. G. Journal: Electromagnetics Issue: Volume 41:Issue 6(2021) Page Start: 448 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗