Investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages. Issue 1 (1st January 2022)

• Record Type: Journal Article
• Authors: Hamid, K. A.; Badarisman, A. H.; Jalar, A.; Bakar, M. A.
• Is Part Of: Journal of physics. Volume 2169:Issue 1(2022)
• Publication Date: 2022-01-01
• Subjects: Physics -- Congresses; 530.5
• DOI: 10.1088/1742-6596/2169/1/012016
• Languages: English
• ISSNs: 1742-6588

Abstract

Abstract: Copper wire bonding has got attracted attention over gold wire bonding due to its lower cost. However, despite many unique aspects and properties of copper wire bonding, corrosion of copper wire bonding has become a point of interest as it leads to the failure of semiconductor packages. Current and future trends and development in miniaturization and multifunction of the semiconductor packages show semiconductor manufacturers to establish good wire bonding with high reliability. However, this trend becomes a significant challenge in respect of corrosion occurrence. Several studies on the corrosion of copper wire bonding; however, there is no considerable study in the integrated factors leading to corrosion. Therefore, this paper focuses on investigating the corrosion phenomena of wire copper wire bonding, especially wedge bonds. This paper use a combination of the problem-solving approach for a complex problem. The analysis suggested that the weightage of factors, depending on process parameters and process steps, play a particular role in facilitating or preventing corrosion on the copper wire bonding. Therefore, it is essential to consider these factors when designing assembly process steps and parameters to control corrosion in semiconductor packages.