Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow. (1st February 2016)

• Record Type: Journal Article
• Authors: Abdul Aziz, M. S.; Abdullah, M. Z.; Khor, C. Y.; Jalar, A.; Che Ani, F.; yan, Nobe.; Cheok, C.
• Is Part Of: Numerical heat transfer. Volume 69:Number 3(2016)
• Page Start: 295
• Page End: 310
• Publication Date: 2016-02-01
• Subjects: Heat -- Transmission -- Measurement -- Periodicals; Mass transfer -- Measurement -- Periodicals; Numerical analysis -- Periodicals; 621.4022
• DOI: 10.1080/10407782.2015.1069675
• Languages: English
• ISSNs: 1040-7782

Abstract

ABSTRACT: This study aims to investigate the influence of a conveyor angle on capillary flow during the wave soldering process. Finite volume-based simulation is utilized to study the capillary flow of molten solder. Molten solder filling through capillary action of a pin-through-hole (PTH) is considered at different conveyor angles (i.e., 0–10°). Two PTH positions, namely, center (r/R = 0.2) and offset (r/R = 0.6), are investigated. The effects of a conveyor angle on molten solder filling volume, time, pressure profile, and velocity vector are numerically analyzed.