1. An efficient and simple compact modeling approach for 3-D interconnects with IC׳s stack global electrical context consideration. Issue 2 (February 2015) Authors: Lorival, Jean-Etienne; Calmon, Francis; Sun, Fengyuan; Frantz, Felipe; Plossu, Carole; Le Berre, Martine; O'Connor, Ian; Valorge, Olivier; Charbonnier, Jean; Henry, David; Gontrand, Christian Journal: Microelectronics journal Issue: Volume 46:Issue 2(2015) Page Start: 153 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Corrigendum to "Modelling of through silicon via and devices electromagnetic coupling" [Microelectron. J. 42 (2011) 316–324]. Issue 11 (November 2015) Authors: Abouelatta-Ebrahim, Mohamed; Dahmani, Rabah; Valorge, Olivier; Calmon, Francis; Gontrand, Christian Journal: Microelectronics journal Issue: Volume 46:Issue 11(2015) Page Start: 1103 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Digital communication techniques. (2020) Authors: Gontrand, Christian Record Type: Book Extent: 1 online resource View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Electrical modeling of tapered TSV including MOS-Field effect and substrate parasitics: Analysis and application. (June 2020) Authors: Nabil, Amira; Bernardo, Jose A.; Ma, Yue; Abouelatta, Mohamed; Shaker, Ahmed; Bouchet, Latifa Fakri; Ragai, Hani; Gontrand, Christian Journal: Microelectronics journal Issue: Volume 100(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Electromagnetism : Links to Special Relativity /: Links to Special Relativity. (2022) Authors: Gontrand, Christian Record Type: Book Extent: 1 online resource (304 pages) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Impact of TSV location in HVIC on CMOS operation: A mixed-mode TCAD simulation study. (May 2018) Authors: Abouelatta, Mohamed; Shaker, Ahmed; Gontrand, Christian Journal: Microelectronics journal Issue: Volume 75(2018) Page Start: 113 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Intégration en électronique de puissance. (2022) Other Names: Abouelatta, Mohamed; Shaker, Ahmed; Gontrand, Christian Record Type: Book Extent: 1 online resource View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Micro-nanoelectronics components : modeling of diffusion and operation processes /: modeling of diffusion and operation processes. (2018) Authors: Gontrand, Christian Record Type: Book Extent: 1 online resource View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Smart power integration. (2022) Authors: Shaker, Ahmed; Gontrand, Christian; Abouelatta, Mohamed Record Type: Book Extent: 1 online resource View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Substrate, interconnects, noise immunity, and electro-thermal analysis in bulk silicon technology for three-dimensional circuits. (2019) Authors: (Electronics engineer), Ma, Yue; Gontrand, Christian Record Type: Book Extent: 1 online resource, illustrations (black and white) View Content: Available online (eLD content is only available in our Reading Rooms) ↗