Cite
MLA Citation
T Aono et al.. “Erratum: Development of wafer-level-packaging technology for simultaneous sealing of accelerometer and gyroscope under different pressures (2016 J. Micromech. Microeng. 26105007).” Journal of micromechanics and microengineering, vol. 27, n.d., p. . http://access.bl.uk/ark:/81055/vdc_100061673473.0x00001f