Erratum: Development of wafer-level-packaging technology for simultaneous sealing of accelerometer and gyroscope under different pressures (2016 J. Micromech. Microeng. 26105007). (11th April 2017)

Record Type:: Journal Article
Title:: Erratum: Development of wafer-level-packaging technology for simultaneous sealing of accelerometer and gyroscope under different pressures (2016 J. Micromech. Microeng. 26105007). (11th April 2017)
Main Title:: Erratum: Development of wafer-level-packaging technology for simultaneous sealing of accelerometer and gyroscope under different pressures (2016 J. Micromech. Microeng. 26105007)
Authors:: Aono, T
Suzuki, K
Kanamaru, M
Okada, R
Maeda, D
Hayashi, M
Isono, Y
Abstract:
Is Part Of:: Journal of micromechanics and microengineering. Volume 27:Number 5(2017:May)
Journal:: Journal of micromechanics and microengineering
Issue:: Volume 27:Number 5(2017:May)
Issue Display:: Volume 27, Issue 5 (2017)
Year:: 2017
Volume:: 27
Issue:: 5
Issue Sort Value:: 2017-0027-0005-0000
Page Start:
Page End:
Publication Date:: 2017-04-11
Subjects:: Microelectromechanical systems -- Periodicals
Micromechanics -- Periodicals
621.38105
Journal URLs:: http://iopscience.iop.org/0960-1317 ↗
http://ioppublishing.org/ ↗
DOI:: 10.1088/1361-6439/aa681f ↗
Languages:: English
ISSNs:: 0960-1317
Deposit Type:: Legaldeposit
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:: British Library DSC - BLDSS-3PM
British Library STI - ELD Digital store
Ingest File:: 9037.xml