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APA Citation
Aono, T., Suzuki, K., Kanamaru, M., Okada, R., Maeda, D., Hayashi, M., & Isono, Y. (n.d.). erratum: Development of wafer-level-packaging technology for simultaneous sealing of accelerometer and gyroscope under different pressures (2016 J. Micromech. Microeng. 26105007). Journal of micromechanics and microengineering, 27, . http://access.bl.uk/ark:/81055/vdc_100061673473.0x00001f