Cite
MLA Citation
Juan Cepeda-Rizo et al.. Thermal and structural electronic packaging analysis for space and extreme environments. Boca Raton : CRC Press, 2021. http://access.bl.uk/ark:/81055/vdc_100136938391.0x000001
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Juan Cepeda-Rizo et al.. Thermal and structural electronic packaging analysis for space and extreme environments. Boca Raton : CRC Press, 2021. http://access.bl.uk/ark:/81055/vdc_100136938391.0x000001