Cite
APA Citation
Cepeda-Rizo, J., Gayle, J., & Ravich, J. (2021). Thermal and structural electronic packaging analysis for space and extreme environments. Boca Raton : CRC Press. http://access.bl.uk/ark:/81055/vdc_100136938391.0x000001
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Cepeda-Rizo, J., Gayle, J., & Ravich, J. (2021). Thermal and structural electronic packaging analysis for space and extreme environments. Boca Raton : CRC Press. http://access.bl.uk/ark:/81055/vdc_100136938391.0x000001