Thermal and structural electronic packaging analysis for space and extreme environments. (2021)

• Record Type: Book
• Further Information: Note: Juan Cepeda-Rizo, Jeremiah Gayle and Joshua Ravich.
• Authors: Cepeda-Rizo, Juan; Gayle, Jeremiah; Ravich, Joshua
• Contents: Introduction. New Space. Thermal/Structural Challenges in Miniaturizing. Fundamental of Heat Transfer by Conduction and Convection. Fundamentals of Heat Transfer by Radiation. The Multi-Layer Insulation (MLI) Blanket. Heat Pipes. Convective Cooling of Semiconductors using a Nanofluid. Power Systems: The Tesla Turbine. Electronics Design for Extreme Temperature and Pressure. Characterization and Modeling of PWB Warpage and its Effect on LGA Separable Interconnects. Resistor Networks. Thermal Analysis Case Studies. Random Vibration Structural Analysis and Mile’s Equation. Vibrational Analysis Case Studies. Creep Prediction of a Printed Wiring Board for Separable Land Grid Array Connector. Operational Case Studies – Mars Surface Operations. Operational Case Studies – Dawn Asteroid Mission. Standards.
• Edition: 1st
• Publisher Details: Boca Raton : CRC Press
• Publication Date: 2021
• Extent: 1 online resource, illustrations (black and white)
• Subjects: 621.381046; Electronic packaging; Space vehicles -- Electronic equipment -- Design and construction; Astrionics; Extreme environments
• Languages: English
• ISBNs: 9781000511086; 9781000511079; 9781003247005
• Related ISBNs: 9781032160818
• Notes: Note: Includes bibliographical references and index.; Note: Description based on CIP data; resource not viewed.
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.