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MLA Citation
Jie Cheng. Research on chemical mechanical polishing mechanism of novel diffusion barrier Ru for Cu interconnect. Singapore : Springer, 2018. http://access.bl.uk/ark:/81055/vdc_100078551751.0x000001
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Jie Cheng. Research on chemical mechanical polishing mechanism of novel diffusion barrier Ru for Cu interconnect. Singapore : Springer, 2018. http://access.bl.uk/ark:/81055/vdc_100078551751.0x000001