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APA Citation
Cheng, J. (2018). Research on chemical mechanical polishing mechanism of novel diffusion barrier Ru for Cu interconnect. Singapore : Springer. http://access.bl.uk/ark:/81055/vdc_100078551751.0x000001
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Cheng, J. (2018). Research on chemical mechanical polishing mechanism of novel diffusion barrier Ru for Cu interconnect. Singapore : Springer. http://access.bl.uk/ark:/81055/vdc_100078551751.0x000001