1. Wafer-level chip-scale packaging : analog and power semiconductor applications /: analog and power semiconductor applications. ([2015]) Authors: Qu, Shichun; Liu, Yong Record Type: Book Extent: 1 online resource View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Fan-out wafer-level packaging. (2018) Authors: Lau, John H Record Type: Book Extent: 1 online resource (xx, 303 pages), illustrations (some color) View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Advances in embedded and fan-out wafer level packaging technologies. (2019) Editors: Keser, Beth, 1971-; Kroehnert, Steffen, 1970- Record Type: Book Extent: 1 online resource View Content: Available online (eLD content is only available in our Reading Rooms) ↗