Wafer-level chip-scale packaging : analog and power semiconductor applications /: analog and power semiconductor applications. ([2015])

• Record Type: Book
• Further Information: Note: Shichun Qu, Yong Liu.
• Authors: Qu, Shichun; Liu, Yong
• Contents: Chapter 1. Demand and Challenges for Wafer Level Analog and Power Packaging -- Chapter 2. Fan-In Analog Wafer Level Chip Scale Package -- Chapter 3. Fan-Out Analog Wafer Level Chip Scale Package -- Chapter 4. Wafer Level Analog Chip Scale Package Stackable Design -- Chapter 5. Wafer Level Discrete Power MOSFET Package Design -- Chapter 6. Wafer Level Packaging TSV/Stack die for Integration of Analog and Power Solution -- Chapter 7. Thermal Management, Design, Analysis for WLCSP -- Chapter 8. Electrical and Multi-Physics Simulations for Analog and Power WLCSP -- Chapter 9. WLCSP Typical Assembly Process -- Chapter 10. WLCSP Typical Reliability and Test.
• Publisher Details: New York : Springer
• Publication Date: 2015
• Copyright Date: 2015
• Extent: 1 online resource
• Subjects: 621; Engineering; Chip scale packaging; TECHNOLOGY & ENGINEERING -- Mechanical; Chip scale packaging; Technology & Engineering -- Electronics -- Circuits -- General; Science -- Mechanics -- Dynamics -- Thermodynamics; Circuits & components; Engineering thermodynamics; Electronics; Systems engineering; Technology & Engineering -- Electronics -- General; Electronics engineering; Electronic books
• Languages: English
• ISBNs: 9781493915569; 1493915568; 9781493915552
• Related ISBNs: 149391555X; 9781493915552
• Notes: Note: Online resource; title from PDF title page (Ebsco, viewed September 18, 2014).
• Access Rights: Legal Deposit; Only available on premises controlled by the deposit library and to one user at any one time; The Legal Deposit Libraries (Non-Print Works) Regulations (UK).
• Access Usage: Restricted: Printing from this resource is governed by The Legal Deposit Libraries (Non-Print Works) Regulations (UK) and UK copyright law currently in force.