Is Part Of: Soldering & surface mount technology. Volume 31:Issue 2(2019) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Soldering & surface mount technology. Volume 31:Issue 2(2019)

1. Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly. Issue 2 (18th December 2018)

Authors:: Che Ani, Fakhrozi; Jalar, Azman; Saad, Abdullah Aziz; Khor, Chu Yee; Abas, Mohamad Aizat; Bachok, Zuraihana; Othman, Norinsan Kamil
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 2(2019)
Page Start:: 109
Record Type:: Journal Article
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2. Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly. Issue 2 (1st April 2019)

Authors:: Che Ani, Fakhrozi; Jalar, Azman; Saad, Abdullah Aziz; Khor, Chu Yee; Abas, Mohamad Aizat; Bachok, Zuraihana; Othman, Norinsan Kamil
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 2(2019)
Page Start:: 109
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

3. Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition. Issue 2 (1st April 2019)

Authors:: Wan Yusoff, Wan Yusmawati; Ismail, Norliza; Safee, Nur Shafiqa; Ismail, Ariffin; Jalar, Azman; Abu Bakar, Maria
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 2(2019)
Page Start:: 102
Record Type:: Journal Article
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4. Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition. Issue 2 (2nd April 2019)

Authors:: Wan Yusoff, Wan Yusmawati; Ismail, Norliza; Safee, Nur Shafiqa; Ismail, Ariffin; Jalar, Azman; Abu Bakar, Maria
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 2(2019)
Page Start:: 102
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

5. Cover PDF. Issue 2 (20th February 2019)

Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 2(2019)
Page Start:
Record Type:: Journal Article
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6. Design of a bi-manual haptic interface for skill acquisition in surface mount device soldering. Issue 2 (1st April 2019)

Authors:: James, Jose; Rao R., Bhavani; Neamtu, Gabriel
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 2(2019)
Page Start:: 133
Record Type:: Journal Article
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7. Design of a bi-manual haptic interface for skill acquisition in surface mount device soldering. Issue 2 (8th February 2019)

Authors:: James, Jose; Rao R., Bhavani; Neamtu, Gabriel
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 2(2019)
Page Start:: 133
Record Type:: Journal Article
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8. Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys. Issue 2 (1st April 2019)

Authors:: Gharaibeh, Mohammad; Stewart, Aaron J.; Su, Quang T.; Pitarresi, James M.
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 2(2019)
Page Start:: 77
Record Type:: Journal Article
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9. Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys. Issue 2 (22nd November 2018)

Authors:: Gharaibeh, Mohammad; Stewart, Aaron J.; Su, Quang T.; Pitarresi, James M.
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 2(2019)
Page Start:: 77
Record Type:: Journal Article
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10. Influence of thermal shock cycles on Sn-37Pb solder bumps. Issue 2 (1st April 2019)

Authors:: Gan, Guisheng; Xia, Da-quan; Liu, Xin; Liu, Cong; Cheng, Hanlin; Ming, Zhongzhen; Gao, Haoyang; Yang, Dong-hua; Wu, Yi-ping
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 2(2019)
Page Start:: 85
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗