Is Part Of: Microelectronics and reliability. Volume 66(2016) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Microelectronics and reliability. Volume 66(2016)

1. Analysis of electrical parameters of InGaN-based LED packages with aging. (November 2016)

Authors:: Jayawardena, Asiri; Narendran, Nadarajah
Journal:: Microelectronics and reliability
Issue:: Volume 66(2016)
Page Start:: 22
Record Type:: Journal Article
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2. Analytical parameter extraction for NBTI reaction diffusion and trapping/detrapping models. (November 2016)

Authors:: Wang, YanLing; Li, XiaoJin; Qing, Jian; Zeng, Yan; Shi, YanLing; Guo, Ao; Hu, ShaoJian; Chen, Shoumian; Zhao, Yuhang
Journal:: Microelectronics and reliability
Issue:: Volume 66(2016)
Page Start:: 10
Record Type:: Journal Article
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3. Characteristics of ESD protection devices operated under elevated temperatures. (November 2016)

Authors:: Liang, Wei; Dong, Aihua; Li, Hang; Miao, Meng; Kuo, Chung-Chen; Klebanov, Maxim; Liou, Juin J.
Journal:: Microelectronics and reliability
Issue:: Volume 66(2016)
Page Start:: 46
Record Type:: Journal Article
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4. Correlation of carbon doping variations with the vertical breakdown of GaN-on-Si for power electronics. (November 2016)

Authors:: Knetzger, Michael; Meissner, Elke; Derluyn, Joff; Germain, Marianne; Friedrich, Jochen
Journal:: Microelectronics and reliability
Issue:: Volume 66(2016)
Page Start:: 16
Record Type:: Journal Article
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5. Developing a Simplified Analytical Thermal Model of Multi-chip Power Module. (November 2016)

Authors:: Bouguezzi, Sihem; Ayadi, Moez; Ghariani, Moez
Journal:: Microelectronics and reliability
Issue:: Volume 66(2016)
Page Start:: 64
Record Type:: Journal Article
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6. Dielectric charging induced drift in micro device reliability-a review. (November 2016)

Authors:: Zhou, Wu; He, Jiangbo; He, Xiaoping; Yu, Huijun; Peng, Bei
Journal:: Microelectronics and reliability
Issue:: Volume 66(2016)
Page Start:: 1
Record Type:: Journal Article
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7. Editorial Board. (November 2016)

Journal:: Microelectronics and reliability
Issue:: Volume 66(2016)
Page Start:: IFC
Record Type:: Journal Article
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8. Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array. (November 2016)

Authors:: Ng, Fei Chong; Abas, Aizat; Ishak, MHH; Abdullah, MZ; Aziz, Abdul
Journal:: Microelectronics and reliability
Issue:: Volume 66(2016)
Page Start:: 143
Record Type:: Journal Article
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9. Evaluation and modeling of adhesion layer in shock-protection structure for MEMS accelerometer. (November 2016)

Authors:: Yamane, Daisuke; Konishi, Toshifumi; Safu, Teruaki; Toshiyoshi, Hiroshi; Sone, Masato; Masu, Kazuya; Machida, Katsuyuki
Journal:: Microelectronics and reliability
Issue:: Volume 66(2016)
Page Start:: 78
Record Type:: Journal Article
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10. Free convective heat transfer coefficient for high powered and tilted QFN64 electronic device. (November 2016)

Authors:: Baïri, A.
Journal:: Microelectronics and reliability
Issue:: Volume 66(2016)
Page Start:: 85
Record Type:: Journal Article
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