Is Part Of: Microelectronics and reliability. Volume 102(2019) - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Is Part Of Microelectronics and reliability. Volume 102(2019)

1. A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles. (November 2019)

Authors:: Matallana, A.; Robles, E.; Ibarra, E.; Andreu, J.; Delmonte, N.; Cova, P.
Journal:: Microelectronics and reliability
Issue:: Volume 102(2019)
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Record Type:: Journal Article
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2. A single event upset hardened flip-flop design utilizing layout technique. (November 2019)

Authors:: Wang, Haibin; Chu, Jiamin; Wei, Jinghe; Shi, Junwei; Sun, Hongwen; Han, Jianwei; Qian, Rong
Journal:: Microelectronics and reliability
Issue:: Volume 102(2019)
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3. AM3D: An accurate crosstalk probability modeling to predict channel delay in 3D ICs. (November 2019)

Authors:: Shirmohammadi, Zahra; Nikoofard, Amirhossein; Ershadi, Ghazal
Journal:: Microelectronics and reliability
Issue:: Volume 102(2019)
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4. Analysis of Schottky emission electric charge transport mechanism in Cu-Lu2O3-Cu MIM structure by temperature dependent current-voltage characteristics. (November 2019)

Authors:: Akbar, Shahnaz; Jacob, Jolly; Mahmood, Khalid; Wasiq, M.F.; Jaffari, Ghulam Hassnain; Khan, Muhammad Azhar
Journal:: Microelectronics and reliability
Issue:: Volume 102(2019)
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5. Degradation in electrothermal characteristics of 4H-SiC junction barrier Schottky diodes under high temperature power cycling stress. (November 2019)

Authors:: Tang, Yidan; Ge, Lan; Gu, Hang; Bai, Yun; Luo, Yafei; Li, Chengzhan; Liu, Xinyu
Journal:: Microelectronics and reliability
Issue:: Volume 102(2019)
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6. Editorial Board. (November 2019)

Journal:: Microelectronics and reliability
Issue:: Volume 102(2019)
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7. Editorial: IPFA 2018. (November 2019)

Authors:: Chin, Jiann Min
Journal:: Microelectronics and reliability
Issue:: Volume 102(2019)
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8. Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking. (November 2019)

Authors:: Panchenko, Iuliana; Wolter, Klaus-Juergen; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Beyne, Eric; Wolf, M. Juergen
Journal:: Microelectronics and reliability
Issue:: Volume 102(2019)
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9. Heavy ion irradiation effects on GaN/AlGaN high electron mobility transistor failure at off-state. (November 2019)

Authors:: Islam, Zahabul; Paoletta, Angela L.; Monterrosa, Anthony M.; Schuler, Jennifer D.; Rupert, Timothy J.; Hattar, Khalid; Glavin, Nicholas; Haque, Aman
Journal:: Microelectronics and reliability
Issue:: Volume 102(2019)
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10. Heavy-ion induced radiation effects in 50 nm NAND floating gate flash memories. (November 2019)

Authors:: Yin, Ya-nan; Liu, Jie; Liu, Tian-qi; Ye, Bing; Ji, Qing-gang; Sun, You-mei; Zhou, Xin-jie
Journal:: Microelectronics and reliability
Issue:: Volume 102(2019)
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