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- Banerjee, I. 1
- Cao, Xin‐yuan 1
- Chae, J.‐H. 1
- Chan, Chi Hou 1
- Chang, Da‐Chiang 1
- Chen, Jingfeng 1
- Chen, L. 1
- Chen, Ming‐Sheng 1
- Chen, Wenhua 1
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- Electronics -- Periodicals 33
- CDS circuit -- BLA function -- X‐ray CCD application -- correlated double sampling circuits -- X‐ray charge‐coupled devices -- X‐ray astronomical field -- clamping switch -- signal path -- sampling switch -- thermal noise -- baseline adjustment circuit -- BLA circuit -- ASIC -- GlobalFoundries CMOS process -- pixel rate -- integral nonlinearity -- equivalent input noise performance -- power consumption -- size 0.35 mum -- frequency 100 kHz to 1 MHz -- power 10 mW -- voltage 3.3 V 1
- EC display -- textile -- dispenser printed electrochromic display -- PEDOT:PSS -- EC material -- lateral structural design -- PVC -- coating -- polyester woven fabric -- thermal damage -- colour changing -- counter electrode -- VDC -- microcontroller -- seven segment display -- time 5 s 1
- Importance sampling -- transformed weights -- Monte Carlo‐based techniques -- probability distribution -- transformed IW -- importance weights 1
- Monte‐Carlo simulation -- bit error rate -- two‐element time‐modulated array -- orbital angular momentum modes -- time‐modulated harmonic characteristic analysis -- high‐sensitivity OAM phase gradient detection method 1
- UHF phase shifters -- delay lock loops -- CMOS integrated circuits -- phase detectors -- delay lines 1
- VSSDifLMS algorithm -- DifLMS algorithm -- intermediate posteriori error -- noise signal influence -- NPVSSDifLMS algorithm -- adaptive network -- nonparametric variable step‐size diffusion LMS algorithm 1
- V‐band dual‐polarised dielectric resonator antenna -- bondwire feeding structures -- silicon‐based integrated passive device technology -- bondwire coupling structures -- circularly polarised systems -- frequency 52.8 GHz to 65 GHz -- Si 1
- active die embedded substrate -- fan out wafer level packaging -- die shift value -- FR‐4‐based substrate -- copper pads -- SAC305 solder -- glass dies -- UBM pads -- self‐alignment effect -- back‐sided under bump metallurgy -- die shift issue -- fan‐out package applications -- process enabling highly accurate die position 1